P.T. Vianco: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Influence of temperature and humidity on the wettability of immersion tin coated printed wiring boards

Ray, U., Artaki, I., Vianco, P.T.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1995

Language:

english

File:

PDF, 942 KB

english, 1995

2

Solderability Preservative Coatings: Electroless Tin vs Organic Azoles

Artaki, I., Ray, U., Jackson, A.M., Gordon, H.M., Vianco, P.T.

Journal:

Year:

1994

Language:

english

File:

PDF, 493 KB

english, 1994

3

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Vianco, Paul T., Kilgo, Alice C., McKenzie, Bonnie M.

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 12.98 MB

english, 2018

4

Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

Paul T. Vianco, Jerome A. Rejent, Arlo F. Fossum, Michael K. Neilsen

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2007

Language:

english

File:

PDF, 1.76 MB

english, 2007

5

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Paul T. Vianco, Jerome A. Rejent, Paul F. Hlava

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 2.15 MB

english, 2004

6

Resistivity and adhesive strength of thin film metallizations on single crystal quartz

Vianco, P.T., Sifford, C.H., Romero, J.A.

Journal:

IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control

Year:

1997

Language:

english

File:

PDF, 1.62 MB

english, 1997

7

Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste

Artaki, I., Jackson, A.M., Vianco, P.T.

Journal:

Soldering & Surface Mount Technology

Year:

1995

Language:

english

File:

PDF, 634 KB

english, 1995

8

The impact of process parameters on gold elimination from soldered connector assemblies

Vianco, P.T., Kilgo, A.C.

Journal:

Soldering & Surface Mount Technology

Year:

2000

Language:

english

File:

PDF, 312 KB

english, 2000

9

Behavior of Lead-Free Solder Under Thermomechanical Loading

Wei, Y., Chow, C. L., Lau, K. J., Vianco, P., Fang, H. E.

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 459 KB

english, 2004

10

Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates

D. F. Susan, J. A. Rejent, P. F. Hlava, P. T. Vianco

Journal:

Journal of Materials Science

Year:

2009

Language:

english

File:

PDF, 683 KB

english, 2009

11

Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses

P. T. Vianco, J. A. Rejent

Journal:

Journal of Electronic Materials

Year:

1999

Language:

english

File:

PDF, 2.48 MB

english, 1999

12

Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis

P. T. Vianco, J. A. Rejent

Journal:

Journal of Electronic Materials

Year:

1999

Language:

english

File:

PDF, 2.28 MB

english, 1999

13

The compression stress-strain behavior of Sn-Ag-Cu solder

Paul T. Vianco, Jerome A. Rejent, Joseph J. Martin

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2003

Language:

english

File:

PDF, 282 KB

english, 2003

14

Evaluation of Lead- Free Solder Joints in Electronic Assemblies

I. Artaki, A. M. Jackson, P. T. Vianco

Journal:

Journal of Electronic Materials

Year:

1994

Language:

english

File:

PDF, 1.16 MB

english, 1994

15

Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings

Paul T. Vianco, Paul F. Hlava, Alice C. Kilgo

Journal:

Journal of Electronic Materials

Year:

1994

Language:

english

File:

PDF, 1.66 MB

english, 1994

16

Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys

D. R. Frear, P. T. Vianco

Journal:

Metallurgical and Materials Transactions A

Year:

1994

Language:

english

File:

PDF, 4.62 MB

english, 1994

17

Synthesis of 2,3-O-isopropylidene-D-glyceraldehyde in high chemical and optical purity: observations on the development of a practical bulk process

Schmid, Christopher R., Bryant, Jerry D., Dowlatzedah, Mandy, Phillips, Joseph L., Prather, Douglas E., Schantz, Renee D., Sear, Nancy L., Vianco, Catherine S.

Journal:

Journal of Organic Chemistry

Year:

1991

Language:

english

File:

PDF, 480 KB

english, 1991

18

[IEEE 1994 Proceedings. 44th Electronic Components and Technology Conference - Washington, DC, USA (1-4 May 1994)] 1994 Proceedings. 44th Electronic Components and Technology Conference - The influence of temperature and humidity on the wettability of immersion tin coated printed wiring boards

Ray, U., Artaki, I., Vianco, P.T.

Year:

1994

Language:

english

File:

PDF, 986 KB

english, 1994

19

Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples

Vianco, P.T., Stephens, J.J., Rejent, J.A.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1997

Language:

english

File:

PDF, 465 KB

english, 1997

20

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Acceleration models, constitutive equations, and reliability of lead-free solders and joints

Lau, J., Danksher, W., Vianco, P.

Year:

2003

Language:

english

File:

PDF, 584 KB

english, 2003

21

Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects

Pierce, David M., Sheppard, Sheri D., Vianco, Paul T., Regent, Jerome A., Grazier, J. Mark

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 1.87 MB

english, 2008

22

A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects

Pierce, David M., Sheppard, Sheri D., Vianco, Paul T.

Journal:

Journal of Electronic Packaging

Year:

2009

Language:

english

File:

PDF, 1.16 MB

english, 2009

23

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

Pierce, David M., Sheppard, Sheri D., Fossum, Arlo F., Vianco, Paul T., Neilsen, Mike K.

Journal:

Journal of Electronic Packaging

Year:

2008

Language:

english

File:

PDF, 731 KB

english, 2008

24

A methodology to establish baseline metrics for assessing the isothermally aging of Sn‐Pb solder interconnects

Vianco, P.T., Rejent, J.A.

Journal:

Soldering & Surface Mount Technology

Year:

2002

Language:

english

File:

PDF, 971 KB

english, 2002

25

A Practical Viscoplastic Damage Model for Lead-Free Solder

Fossum, A. F., Vianco, P. T., Neilsen, M. K., Pierce, D. M.

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 340 KB

english, 2006

26

UCPD Model for Pb-Free Solder

Neilsen, Michael K., Vianco, Paul T.

Journal:

Journal of Electronic Packaging

Year:

2014

Language:

english

File:

PDF, 2.07 MB

english, 2014

27

A Review of Interface Microstructures in Electronic Packaging Applications: Soldering Technology

Vianco, Paul T.

Journal:

Year:

2018

Language:

english

File:

PDF, 6.89 MB

english, 2018

28

Negative creep in an amorphous metallic alloy

P.T. Vianco, J.C.M. Li

Journal:

Materials Science and Engineering

Year:

1987

Language:

english

File:

PDF, 948 KB

english, 1987

29

Interface reactions between 50In–50Pb solder and electroplated Au layers

P. Vianco, G. Bryant, P. Hlava, G. Zender

Journal:

Materials Science and Engineering: A

Year:

2005

Language:

english

File:

PDF, 1.32 MB

english, 2005

30

Interface flow mechanism for tin whisker growth

H.P. Howard, J. Cheng, P.T. Vianco, J.C.M. Li

Journal:

Acta Materialia

Year:

2011

Language:

english

File:

PDF, 1.76 MB

english, 2011

31

Solid state intermetallic compound layer growth between copper and hot dipped indium coatings

P. T. Vianco, A. C. Kilgo, R. Grant

Journal:

Journal of Materials Science

Year:

1995

Language:

english

File:

PDF, 1.06 MB

english, 1995

32

Annealing of shear bands in metallic glasses

P. T. Vianco, J. C. M. Li

Journal:

Journal of Materials Science

Year:

1987

Language:

english

File:

PDF, 2.69 MB

english, 1987

33

An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis

Jing Cheng, Paul T. Vianco, Joeseph Subjeck, James C. M. Li

Journal:

Journal of Materials Science

Year:

2011

Language:

english

File:

PDF, 1.52 MB

english, 2011

34

Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

Paul T. Vianco, Robert D. Wright, Paul F. Hlava, Joseph J. Martin

Journal:

Metallurgical and Materials Transactions A

Year:

2006

Language:

english

File:

PDF, 532 KB

english, 2006

35

Solid-State Interface Reactions between Silver and 95.5Sn-3.9Ag-0.6Cu and 63Sn-37Pb Solders

Paul T. Vianco, Joseph J. Martin, Robert D. Wright, Paul F. Hlava

Journal:

Metallurgical and Materials Transactions A

Year:

2007

Language:

english

File:

PDF, 1.10 MB

english, 2007

36

Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

Paul T. Vianco, Jerome A. Rejent, Gary L. Zender, Paul F. Hlava

Journal:

Metallurgical and Materials Transactions A

Year:

2010

Language:

english

File:

PDF, 1021 KB

english, 2010

37

Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

Paul T. Vianco, Jerome A. Rejent, Gary L. Zender, Paul F. Hlava

Journal:

Metallurgical and Materials Transactions A

Year:

2010

Language:

english

File:

PDF, 971 KB

english, 2010

38

Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 592 KB

english, 2003

39

Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-Plated kovar

Edwin P. Lopez, Paul T. Vianco, Jerome A. Rejent

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 288 KB

english, 2003

40

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II—Aged condition

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 3.36 MB

english, 2004

41

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder—Part I: As-cast condition

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.58 MB

english, 2004

42

Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated kovar substrates

Edwin P. Lopez, Paul T. Vianco, Jerome A. Rejent

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 956 KB

english, 2005

43

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part

P. T. Vianco, J. A. Rejent

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 542 KB

english, 2009

44

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part

P. T. Vianco, J. A. Rejent

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 690 KB

english, 2009

45

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Edwin P. Lopez, Paul T. Vianco, Jerome A. Rejent, Carly George, Alice Kilgo

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 743 KB

english, 2010

46

Optimum Thickness of Sn Film for Whisker Growth

Jing Cheng, Fuqian Yang, Paul T. Vianco, Bei Zhang, James C.M. Li

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 633 KB

english, 2011

47

Modeling the solid-state reaction between Sn-Pb solder and a porous substrate coating

K. L. Erickson, P. L. Hopkins, P. T. Vianco

Journal:

Journal of Electronic Materials

Year:

1998

Language:

english

File:

PDF, 1.08 MB

english, 1998

48

Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue

P. T. Vianco, S. N. Burchett, M. K. Neilsen, J. A. Rejent, D. R. Frear

Journal:

Journal of Electronic Materials

Year:

1999

Language:

english

File:

PDF, 392 KB

english, 1999

49

The influence of temperature and humidity on printed wiring board surface finishes: Immersion tin vs organic azoles

U. Ray, I. Artaki, H. M. Gordon, P. T. Vianco

Journal:

Journal of Electronic Materials

Year:

1994

Language:

english

File:

PDF, 689 KB

english, 1994

50

Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part II: Modeling

K. L. Erickson, P. L. Hopkins, P.T Vianco

Journal:

Journal of Electronic Materials

Year:

1994

Language:

english

File:

PDF, 469 KB

english, 1994